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Measurement of the interfacial strength of thin metal film by laser spallation method for advanced wafer level package

Ju, Young-Min; Um, Hui-Jin; Lee, Se-Min; Kim, Dukyong; Yoo, Woong-Kyoo; Lee, Daewoong; Hwang, Yeontaek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 1260 - 1264
SCIESCOPUS
Rapid PCB warpage modeling through automated copper pattern classification and classical lamination Theory-Driven anisotropic viscoelastic homogenizationGo to Link

Yoo, Woong-Kyoo; Baek, Jeong-Hyeon; Park, Jong-Whi; Kumar, Sanjay; Kim, Hak-Sung

ArticleIssue Date2026CitationCOMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.204, pp 1 - 16PublisherELSEVIER SCI LTD
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