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Photoresist ashing technology using N-2/O-2 ferrite-core ICP in the dual damascene processGo to Link

Kim, Hyoun Woo; Myung, Ju Hyun; Lee, Jong Woo; Kim, Hyung-Sun; Kim, Keeho; Jang, Jeong-Yeol; Yoon, Tae-Ho; Kim, Sung Kyeong; Choi, Dae-Kyu; Chung, Chin-Wook, et al.

ArticleIssue Date2006CitationJournal of Materials Science, v.41, no.15, pp 5040 - 5042PublisherKluwer Academic Publishers
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