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Combination-encoding content-addressable memory with high content density

Authors
정두석
Issue Date
14-Dec-2019
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE International Workshop on Future Computing
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/10464
Conference Name
IEEE International Workshop on Future Computing
Place
Hangzhou
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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Jeong, Doo Seok
COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)
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