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Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo- Sensor Circuits
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 최창환 | - |
| dc.date.accessioned | 2022-02-08T01:50:11Z | - |
| dc.date.available | 2022-02-08T01:50:11Z | - |
| dc.date.created | 2022-01-08 | - |
| dc.date.issued | 2021-06-30 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/134927 | - |
| dc.publisher | 대한전자공학회 | - |
| dc.title | Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo- Sensor Circuits | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 최창환 | - |
| dc.identifier.bibliographicCitation | 대한전자공학회 하계학술대회 | - |
| dc.relation.isPartOf | 대한전자공학회 하계학술대회 | - |
| dc.citation.title | 대한전자공학회 하계학술대회 | - |
| dc.citation.conferencePlace | 롯데호텔 제주 (중문) | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)