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테라헤르츠 파를 이용한 실리콘웨이퍼에 증착된 SiO2 박막 두께 예측에 관한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2022-02-08T01:51:42Z | - |
| dc.date.available | 2022-02-08T01:51:42Z | - |
| dc.date.issued | 2021-06-04 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/135010 | - |
| dc.title | 테라헤르츠 파를 이용한 실리콘웨이퍼에 증착된 SiO2 박막 두께 예측에 관한 연구 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 한국비파괴검사학회 춘계학술대회 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)