Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Power Semiconductor Packaging Approaches for Reliable Power Module Systems
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 윤상원 | - |
| dc.date.accessioned | 2022-05-11T02:52:32Z | - |
| dc.date.available | 2022-05-11T02:52:32Z | - |
| dc.date.created | 2022-05-07 | - |
| dc.date.issued | 2021-11-04 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/136963 | - |
| dc.publisher | Korean Microelectronics and Packaging Society | - |
| dc.title | Power Semiconductor Packaging Approaches for Reliable Power Module Systems | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 윤상원 | - |
| dc.identifier.bibliographicCitation | 19th International Symposium on Microelectronics and Packaging (ISMP) | - |
| dc.relation.isPartOf | 19th International Symposium on Microelectronics and Packaging (ISMP) | - |
| dc.citation.title | 19th International Symposium on Microelectronics and Packaging (ISMP) | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 미래자동차공학과 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.