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Power Semiconductor Packaging Approaches for Reliable Power Module Systems
- Authors
- 윤상원
- Issue Date
- 4-Nov-2021
- Publisher
- Korean Microelectronics and Packaging Society
- Citation
- 19th International Symposium on Microelectronics and Packaging (ISMP)
- Conference Name
- 19th International Symposium on Microelectronics and Packaging (ISMP)
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Collections - 서울 공과대학 > 서울 미래자동차공학과 > 2. Conference Papers
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Related Researcher
- Yoon, Sang Won
- COLLEGE OF ENGINEERING (DEPARTMENT OF AUTOMOTIVE ENGINEERING)