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Approaches of Highly Reliable Package for High Power Electronic Devices
- Authors
- 윤상원
- Issue Date
- 27-Aug-2021
- Publisher
- The Institute of Electronics and Information Engineers, Korea 및 및 The Institute of Electronics, Information and Communication Engineers, Japan
- Citation
- Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD)
- Conference Name
- Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD)
- Place
- Virtual
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Collections - 서울 공과대학 > 서울 미래자동차공학과 > 2. Conference Papers
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