Improvement of Heat Transfer Properties through TiO2 Nanosphere Monolayer Embedded Polymers as Thermal Interface Materialsopen access
- Authors
- Moon, Jinuk; Jung, Uijin; Jung, Bomseumin; Park, Jinsub
- Issue Date
- Feb-2022
- Publisher
- MDPI
- Keywords
- thermal interface material; TiO2 nanosphere; monolayer
- Citation
- APPLIED SCIENCES-BASEL, v.12, no.3, pp.1 - 10
- Indexed
- SCIE
SCOPUS
- Journal Title
- APPLIED SCIENCES-BASEL
- Volume
- 12
- Number
- 3
- Start Page
- 1
- End Page
- 10
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/139592
- DOI
- 10.3390/app12031348
- Abstract
- A thermal interface material (TIM) is a substance that reduces the thermal resistance between a heat source and heat sink, which facilitates heat conduction towards the outside. In this study, a TiO2 nanosphere (NS)-filler based TIM was fabricated via facile processes such as spin-coating and icing methods. Thermal conductivity of the fabricated TiO2 NS-based TIM was enhanced by increasing the loading contents of the TiO2 NS-filler and successfully cooling down the GPU chipset temperature from 62◦C to 50◦C. Moreover, the TIM with the TiO2 NS-monolayer additionally lowered the GPU temperature by 1–7◦C. The COMSOL simulation results show that the TiO2 NS-monolayer, which was in contact with the heat source, boosts the heat transfer characteristics from the heat source toward the inside of the TIM. The suggested metal oxide monolayer-based TIM is an effective structure that reduces the temperature of the device without an additional filler loading, and it is expected to have a wide range of applications for the thermal management of advanced devices.
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