Design and Experimental Evaluation of Transfer-Molded 650 V Super-Junction mosfet Power Module for Industrial Applications
- Authors
- Lim, Jangmuk; Seong, Jihwan; Jeon, Jaejin; Kim, You Suk; Im, Hun-Chang; Hong, Won Sik; Yoon, Sang Won
- Issue Date
- Nov-2021
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Multichip modules; Thermal resistance; Inductance; MOSFET; Switches; Costs; Lead; Low void vacuum reflow soldering; package on-resistance; power cycling; power module; thermal cycling; thermal resistance; transfer molding
- Citation
- IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, v.57, no.6, pp.6295 - 6305
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
- Volume
- 57
- Number
- 6
- Start Page
- 6295
- End Page
- 6305
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/140513
- DOI
- 10.1109/TIA.2021.3113624
- ISSN
- 0093-9994
- Abstract
- This article presents a new transfer-molded design of a four-pack 650 V super-junction mosfet power module. This power module is designed for industrial applications, including solar energy converters and on-board chargers. In these applications, it is critical to reduce the stray inductance, package on-resistance, thermal resistance, volume, and cost of the power modules. These challenges are addressed by optimizing the module design, fabrication process, and selection of components and packaging materials. Eight super-junction mosfets, lead frames, and an SMD thermistor are soldered onto a direct bonded copper substrate, followed by a wire bonding and transfer molding process. The fabricated module exhibits low stray inductance, package on-resistance (similar to 16.3 m omega), thermal resistance (similar to 0.26 K/W), and volume (similar to 43% reduction in comparison with a commercial counterpart). Moreover, the module reliability is successfully demonstrated by electrical isolation (ac voltage of 2,500 V), thermal cycling (-40 to 85 degrees C), and power cycling (up to 100,000 cycles) tests, satisfying international standards.
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