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Preface proceedings of the 7th International Conference on Microelectronics and Plasma Technology (ICMAP 2018), Incheon, Korea
- Authors
- Lee, Nae-Eung; Chae, Hee Yeop; Chung, Chee Won; Kim, Hyun Woo; Kim, Hyoung Sub; Kim, Ji Hyun; Kim, Jiyoung; Lee, Taeyoon; Park, In-Sung; Pu, Yi Kang; Shi, Jianjun; Xu, Ping
- Issue Date
- Jun-2019
- Publisher
- ELSEVIER SCIENCE SA
- Citation
- THIN SOLID FILMS, v.680, pp.37 - 39
- Indexed
- SCIE
SCOPUS
- Journal Title
- THIN SOLID FILMS
- Volume
- 680
- Start Page
- 37
- End Page
- 39
- ISSN
- 0040-6090
- Files in This Item
- Go to Link
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Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
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Related Researcher
- Kim, Hyoun Woo
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)