Electron heating and control of electron energy distribution for the enhancement of the plasma ashing processing
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Hyo-Chang | - |
dc.contributor.author | Chung, Chin-Wook | - |
dc.date.accessioned | 2022-07-07T05:43:20Z | - |
dc.date.available | 2022-07-07T05:43:20Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2015-04 | - |
dc.identifier.issn | 0963-0252 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/143560 | - |
dc.description.abstract | Control of the electron energy distribution function (EEDF) is investigated through applying an inductive field in oxygen capacitively coupled plasma (CCP). With the addition of a small amount of antenna coil power to the CCP, low energy electrons are effectively heated and the EEDF is controlled. This method is applied to the ashing process of the photoresistor (PR). It is revealed that the ashing rate of the PR is significantly increased due to O radicals produced by the controlled EEDF, even though the ion density/energy flux is not increased. The roles of the power transfer mode in the electron heating and plasma control are also presented in the hybrid plasma source with inductive and capacitive fields. This work provides a route to enhance or control the processing result. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | Electron heating and control of electron energy distribution for the enhancement of the plasma ashing processing | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Chung, Chin-Wook | - |
dc.identifier.doi | 10.1088/0963-0252/24/2/024001 | - |
dc.identifier.scopusid | 2-s2.0-84927656601 | - |
dc.identifier.wosid | 000356816200003 | - |
dc.identifier.bibliographicCitation | PLASMA SOURCES SCIENCE & TECHNOLOGY, v.24, no.2, pp.1 - 7 | - |
dc.relation.isPartOf | PLASMA SOURCES SCIENCE & TECHNOLOGY | - |
dc.citation.title | PLASMA SOURCES SCIENCE & TECHNOLOGY | - |
dc.citation.volume | 24 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 7 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Physics, Fluids & Plasmas | - |
dc.subject.keywordPlus | MOLECULAR-DYNAMICS SIMULATIONS | - |
dc.subject.keywordPlus | DISCHARGE | - |
dc.subject.keywordPlus | NANOFABRICATION | - |
dc.subject.keywordPlus | PRESSURE | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | MODE | - |
dc.subject.keywordAuthor | electron heating | - |
dc.subject.keywordAuthor | control of electron energy distribution | - |
dc.subject.keywordAuthor | plasma ashing processing | - |
dc.subject.keywordAuthor | hybrid plasma source | - |
dc.subject.keywordAuthor | plasma coupling effect | - |
dc.identifier.url | https://iopscience.iop.org/article/10.1088/0963-0252/24/2/024001 | - |
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