Thermal Compression Chip Interconnection Using Organic Solderability Preservative Etched Substrate by Plasma Processing
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, Sung-Won | - |
dc.contributor.author | Choi, JoonYoung | - |
dc.contributor.author | Chung, Chin-Wook | - |
dc.date.accessioned | 2022-07-07T07:42:48Z | - |
dc.date.available | 2022-07-07T07:42:48Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2014-12 | - |
dc.identifier.issn | 1533-4880 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/143932 | - |
dc.description.abstract | The solderability of copper organic solderbility preservative (CuOSP) finished substrate was enhanced by the plasma etching. To improve the solderability of TC interconnection with the CuOSP finished substrate, the plasma etching process is used. An Oxygen-Hydrogen plasma treatment process is performed to remove OSP material. To prevent the oxidation by oxygen plasma treatment, hydrogen reducing process is also performed before TC interconnection process. The thickness of OSP material after plasma etching is measured by optical reflection method and the component analysis by Auger Electron Spectroscopy is performed. From the lowered thickness, the bonding force of TC interconnection after OSP etching process is lowered. Also the electrical open/short test was performed after assembling the completed semiconductor packaging. The improved yield due to the plasma etching process is achieved. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | AMER SCIENTIFIC PUBLISHERS | - |
dc.title | Thermal Compression Chip Interconnection Using Organic Solderability Preservative Etched Substrate by Plasma Processing | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Chung, Chin-Wook | - |
dc.identifier.doi | 10.1166/jnn.2014.10178 | - |
dc.identifier.scopusid | 2-s2.0-84911872757 | - |
dc.identifier.wosid | 000344126900127 | - |
dc.identifier.bibliographicCitation | JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.14, no.12, pp.9606 - 9613 | - |
dc.relation.isPartOf | JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | - |
dc.citation.title | JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | - |
dc.citation.volume | 14 | - |
dc.citation.number | 12 | - |
dc.citation.startPage | 9606 | - |
dc.citation.endPage | 9613 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | Auger electron spectroscopy | - |
dc.subject.keywordPlus | Chip scale packages | - |
dc.subject.keywordPlus | Copper | - |
dc.subject.keywordPlus | Hydrogen | - |
dc.subject.keywordPlus | Oxygen | - |
dc.subject.keywordPlus | Plasma applications | - |
dc.subject.keywordPlus | Plasma etching | - |
dc.subject.keywordPlus | Thermal conductivity | - |
dc.subject.keywordPlus | Integrated circuit interconnects | - |
dc.subject.keywordPlus | Flip chip | - |
dc.subject.keywordPlus | Hydrogen plasma treatments | - |
dc.subject.keywordPlus | Nano scale | - |
dc.subject.keywordPlus | Optical reflection method | - |
dc.subject.keywordPlus | Organic solderability preservative | - |
dc.subject.keywordPlus | Oxygen plasma treatments | - |
dc.subject.keywordPlus | Plasma treatment | - |
dc.subject.keywordPlus | Semiconductor packaging | - |
dc.subject.keywordAuthor | Fine Pitch Flipchip | - |
dc.subject.keywordAuthor | Copper Organic Solderability Preservative | - |
dc.subject.keywordAuthor | Nanoscale Copper Pad Surface | - |
dc.subject.keywordAuthor | Plasma Treatment | - |
dc.identifier.url | https://www.ingentaconnect.com/content/asp/jnn/2014/00000014/00000012/art00128;jsessionid=5al9ul1pu3ouk.x-ic-live-03 | - |
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