Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics
DC Field | Value | Language |
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dc.contributor.author | Lee, Sanghyeon | - |
dc.contributor.author | Wajahat, Muhammad | - |
dc.contributor.author | Kim, Jung Hyun | - |
dc.contributor.author | Pyo, Jaeyeon | - |
dc.contributor.author | Chang, Won Suk | - |
dc.contributor.author | Cho, Sung Ho | - |
dc.contributor.author | Kim, Ji Tae | - |
dc.contributor.author | Seol, Seung Kwon | - |
dc.date.accessioned | 2021-08-02T12:27:36Z | - |
dc.date.available | 2021-08-02T12:27:36Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2019-02 | - |
dc.identifier.issn | 1944-8244 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/15083 | - |
dc.description.abstract | Three-dimensional (3D) printing is a next-generation free-form manufacturing technology for structural electronics. The realization of structural electronic devices necessitates the direct integration of electronic circuits into 3D objects. However, creating highly conductive, high-resolution patterns in 3D remains a major challenge. Here, we report on a metallic 3D printing method that incorporates electroless deposition (ELD) into the direct ink writing method. Our approach consists of two steps: (1) direct ink writing of catalyst microstructures with a functional catalyst ink containing Ag ions and (2) ELD of Cu onto the printed catalyst structures. High-quality, stable Cu 3D printing is achieved through the design of the Ag catalyst ink; hydroxypropyl cellulose is added as both a rheological modifier (printing) and dissolution inhibitor (ELD). As a result, various two-dimensional (2D) and 3D Cu micro circuitries with high conductivity (similar to 65% of bulk) can be directly integrated onto 3D plastic substrates without the need for high-temperature annealing. A hybrid strategy that combines ELD-assisted 3D printing and conventional fused deposition modeling enables full fabrication of structural electronic devices. This 3D printing strategy can be a low-cost and facile method for obtaining highly conductive metallic 2D and 3D microstructures in structural electronics. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | AMER CHEMICAL SOC | - |
dc.title | Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Cho, Sung Ho | - |
dc.identifier.doi | 10.1021/acsami.8b18199 | - |
dc.identifier.scopusid | 2-s2.0-85061495460 | - |
dc.identifier.wosid | 000459642200046 | - |
dc.identifier.bibliographicCitation | ACS APPLIED MATERIALS & INTERFACES, v.11, no.7, pp.7123 - 7130 | - |
dc.relation.isPartOf | ACS APPLIED MATERIALS & INTERFACES | - |
dc.citation.title | ACS APPLIED MATERIALS & INTERFACES | - |
dc.citation.volume | 11 | - |
dc.citation.number | 7 | - |
dc.citation.startPage | 7123 | - |
dc.citation.endPage | 7130 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | REDUCED GRAPHENE OXIDE | - |
dc.subject.keywordPlus | MICROARCHITECTURES | - |
dc.subject.keywordPlus | PALLADIUM | - |
dc.subject.keywordPlus | POLYMERS | - |
dc.subject.keywordAuthor | 3D printing | - |
dc.subject.keywordAuthor | structural electronics | - |
dc.subject.keywordAuthor | electroless deposition | - |
dc.subject.keywordAuthor | silver catalyst inks | - |
dc.subject.keywordAuthor | copper | - |
dc.identifier.url | https://pubs.acs.org/doi/10.1021/acsami.8b18199 | - |
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