Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics
- Authors
- Lee, Sanghyeon; Wajahat, Muhammad; Kim, Jung Hyun; Pyo, Jaeyeon; Chang, Won Suk; Cho, Sung Ho; Kim, Ji Tae; Seol, Seung Kwon
- Issue Date
- Feb-2019
- Publisher
- AMER CHEMICAL SOC
- Keywords
- 3D printing; structural electronics; electroless deposition; silver catalyst inks; copper
- Citation
- ACS APPLIED MATERIALS & INTERFACES, v.11, no.7, pp.7123 - 7130
- Indexed
- SCIE
SCOPUS
- Journal Title
- ACS APPLIED MATERIALS & INTERFACES
- Volume
- 11
- Number
- 7
- Start Page
- 7123
- End Page
- 7130
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/15083
- DOI
- 10.1021/acsami.8b18199
- ISSN
- 1944-8244
- Abstract
- Three-dimensional (3D) printing is a next-generation free-form manufacturing technology for structural electronics. The realization of structural electronic devices necessitates the direct integration of electronic circuits into 3D objects. However, creating highly conductive, high-resolution patterns in 3D remains a major challenge. Here, we report on a metallic 3D printing method that incorporates electroless deposition (ELD) into the direct ink writing method. Our approach consists of two steps: (1) direct ink writing of catalyst microstructures with a functional catalyst ink containing Ag ions and (2) ELD of Cu onto the printed catalyst structures. High-quality, stable Cu 3D printing is achieved through the design of the Ag catalyst ink; hydroxypropyl cellulose is added as both a rheological modifier (printing) and dissolution inhibitor (ELD). As a result, various two-dimensional (2D) and 3D Cu micro circuitries with high conductivity (similar to 65% of bulk) can be directly integrated onto 3D plastic substrates without the need for high-temperature annealing. A hybrid strategy that combines ELD-assisted 3D printing and conventional fused deposition modeling enables full fabrication of structural electronic devices. This 3D printing strategy can be a low-cost and facile method for obtaining highly conductive metallic 2D and 3D microstructures in structural electronics.
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