Solution-Processed Plasmonic-Dielectric Sunlight-Collecting Nanofilms for Solar Thermoelectric Application
- Authors
- Lee, Dae Ho; Pyun, Seung Beom; Bae, Yuri; Kang, Dong Pil; Park, Jun-Woo; Cho, Eun Chul
- Issue Date
- Dec-2017
- Publisher
- AMER CHEMICAL SOC
- Keywords
- plasmonic metastructure; spin coating; solar thermal collector; photothermal performance; solar thermoelectricity
- Citation
- ACS APPLIED MATERIALS & INTERFACES, v.9, no.50, pp.43583 - 43595
- Indexed
- SCIE
SCOPUS
- Journal Title
- ACS APPLIED MATERIALS & INTERFACES
- Volume
- 9
- Number
- 50
- Start Page
- 43583
- End Page
- 43595
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/151105
- DOI
- 10.1021/acsami.7b11446
- ISSN
- 1944-8244
- Abstract
- It is important but remains a challenge to develop solution-processed plasmonic solar thermoelectricity films on various substrates, without strictly considering hierarchical plasmonic-dielectric-metal structures, to harvest a wide range of visible to near-infrared sunlight. We simply fabricate plasmonic silica metastructure sunlight-collecting nanofilms on highly reflective Cu and Si surfaces by introducing spin coating (with an Ag and silica colloidal mixture, a spin coater, and a heating plate) and low-temperature annealing (in an oven at 200 degrees C for 1 h) processes. The approximately 250 nm thick metastructure consists of a top 60 nm thick silica layer as an antireflective film and a bottom 190 nm thick Ag nanoparticle-silica hybrid film as a sunlight harvester. The metastructure film reduces the reflectivity of Cu (>90%) and Si (25-35%) to less than 5% at visible to near-infrared frequencies. The metastructure film on the Cu sheet has an absorptance of 0.95 and a thermal emittance of 0.06, ideal for high-performance sunlight absorbers. The solar thermoelectric powers of the film-coated Cu and Si are 15.4 and 4.7 times those of the uncoated Cu and Si substrates, respectively. The metastructure film on Cu exhibited a similar or slightly higher performance than that of a top-class vapor-deposited commercialized absorber film on Cu, demonstrating the robustness of the present method.
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