Flexible Lamination Encapsulation
- Authors
- Park, Min-Ho; Kim, Jin-You; Han, Tae Hee; Kim, Tae-Sik; Kim, Hobeom; Lee, Tae-Woo
- Issue Date
- Aug-2015
- Publisher
- WILEY-V C H VERLAG GMBH
- Keywords
- metal foils; organic electronic devices (OEDs); organic light emitting diodes; passivation; PDMS; roll-to-roll process
- Citation
- ADVANCED MATERIALS, v.27, no.29, pp.4308 - 4314
- Indexed
- SCIE
SCOPUS
- Journal Title
- ADVANCED MATERIALS
- Volume
- 27
- Number
- 29
- Start Page
- 4308
- End Page
- 4314
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/156572
- DOI
- 10.1002/adma.201501856
- ISSN
- 0935-9648
- Abstract
- A novel flexible encapsulation method (Flex Lami-capsulation) is reported, which can be applied in the roll-to-roll process for mass production of organic electronic devices. Flex Lami-capsulation is very simple, fast, and getter-free, and is as effective as glass encapsulation. Use of this method is feasible in large-area flexible displays and does not have the drawbacks of conventional encapsulation methods.
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