Transfer Printing Methods for Flexible Thin Film Solar Cells: Basic Concepts and Working Principles
- Authors
- Lee, Chi Hwan; Kim, Dong Rip; Zheng, Xiaolin
- Issue Date
- Sep-2014
- Publisher
- American Chemical Society
- Keywords
- transfer printing methods; thin film solar cells; flexible solar cells; epitaxial lift-off method; epitaxial layer transfer method; controlled spalling method; peel-and-stick method
- Citation
- ACS Nano, v.8, no.9, pp 8746 - 8756
- Pages
- 11
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- ACS Nano
- Volume
- 8
- Number
- 9
- Start Page
- 8746
- End Page
- 8756
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/159229
- DOI
- 10.1021/nn5037587
- ISSN
- 1936-0851
1936-086X
- Abstract
- Fabricating thin film solar cells (TFSCs) on flexible substrates will not only broaden the applications of solar cells, but also potentially reduce the installation cost. However, a critical challenge for fabricating flexible TFSCs on flexible substrates is the incompatibility issues between the thermal, mechanical, and chemical properties of these substrates and the fabrication conditions. Transfer printing methods, which use conventional substrates for the fabrication and then deliver the TFSCs onto flexible substrates, play a key role to overcome these challenges. In this review, we discuss the basic concepts and working principles of four major transfer printing methods associated with (1) transfer by sacrificial layers, (2) transfer by porous Si layer, (3) transfer by controlled crack, and (4) transfer by water-assisted thin film delamination. We also discuss the challenges and opportunities for implementing these methods for practical solar cell manufacture.
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