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Real time thickness measurement based on terahertz time-domain spectroscopy for chip-top epoxy molding compound in semiconductor package
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Oh, Gyung Hwan | - |
| dc.contributor.author | Park, Dong Woon | - |
| dc.contributor.author | Kim, Dug Joong | - |
| dc.contributor.author | Kim, Hak Sung | - |
| dc.date.accessioned | 2021-08-02T12:53:30Z | - |
| dc.date.available | 2021-08-02T12:53:30Z | - |
| dc.date.created | 2021-05-14 | - |
| dc.date.issued | 2018-10 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/15992 | - |
| dc.description.abstract | The refractive index and thickness of EMC were measured non-destructively using the terahertz time-domain spectroscopy (THz-TDS) system. A theoretical model was developed using an analysis of time response on transmission and reflection THz signals. Using this developed theoretical model, the refractive index of EMC was measured within 1% of the error range. Simultaneously, the thickness of EMC was calculated through the measured refractive index and induced time delay. As a result, the refractive index and thickness of EMC was measured within the error range of 0.9% and 3.0%, respectively. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | IEEE Computer Society | - |
| dc.title | Real time thickness measurement based on terahertz time-domain spectroscopy for chip-top epoxy molding compound in semiconductor package | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Kim, Hak Sung | - |
| dc.identifier.doi | 10.1109/IRMMW-THz.2018.8510029 | - |
| dc.identifier.scopusid | 2-s2.0-85056883218 | - |
| dc.identifier.bibliographicCitation | 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), v.2018, no.September | - |
| dc.relation.isPartOf | 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) | - |
| dc.citation.title | 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) | - |
| dc.citation.volume | 2018 | - |
| dc.citation.number | September | - |
| dc.type.rims | ART | - |
| dc.type.docType | Proceeding | - |
| dc.description.journalClass | 1 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.subject.keywordPlus | Electronics packaging | - |
| dc.subject.keywordPlus | Plasmons | - |
| dc.subject.keywordPlus | Reflectometers | - |
| dc.subject.keywordPlus | Refractive index | - |
| dc.subject.keywordPlus | Spectrophotometers | - |
| dc.subject.keywordPlus | Terahertz waves | - |
| dc.subject.keywordPlus | Thickness measurement | - |
| dc.subject.keywordPlus | Epoxy molding compounds | - |
| dc.subject.keywordPlus | Error range | - |
| dc.subject.keywordPlus | Real time | - |
| dc.subject.keywordPlus | Semiconductor packages | - |
| dc.subject.keywordPlus | Terahertz time domain spectroscopy | - |
| dc.subject.keywordPlus | Theoretical modeling | - |
| dc.subject.keywordPlus | THz signal | - |
| dc.subject.keywordPlus | Terahertz spectroscopy | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8510029 | - |
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)