Charge loss mechanism of non-volatile V3Si nano-particles memory device
- Authors
- Kim, Dongwook; Lee, Dong Uk; Kim, Eun Kyu; Cho, Won-Ju
- Issue Date
- Dec-2012
- Publisher
- AMER INST PHYSICS
- Citation
- APPLIED PHYSICS LETTERS, v.101, no.23, pp.1 - 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- APPLIED PHYSICS LETTERS
- Volume
- 101
- Number
- 23
- Start Page
- 1
- End Page
- 4
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/164080
- DOI
- 10.1063/1.4770060
- ISSN
- 0003-6951
- Abstract
- We studied the charge loss mechanism of a non-volatile memory device with vanadium silicide (V3Si) nano-particles (NPs) embedded in a silicon dioxide dielectric layer. To fabricate the memory device, V3Si NPs with an average size of 4-6 nm were formed between the tunnel and control oxide layers by a thin film deposition and a post-annealing process at 800 degrees C for 5s. Using the gate structure containing the V3Si NPs, a flash memory structure was fabricated with a channel length and width of 5 mu m. This device maintained the memory window at about 1V after 10(4)s when program/erase voltages of +/- 9V were applied for 1 s. The activation energies of the V3Si NP memory devices with charge loss rates of 10%, 15%, 20%, and 25% were approximately 0.16, 0.24, 0.35, and 0.50 eV, respectively. The charge loss mechanism can be attributed to direct tunneling as a result of the NPs associating with the interface trap in the tunneling oxide, the Pool-Frenkel current, and the oxide defect.
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