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Multi-scale simulation of interfacial roughness effects in silicon nanowires

Authors
Kim, Byung-HyunJung, Hyo-EunChung, Yong ChaeShin, MincheolLee, Kwang-Ryeol
Issue Date
Sep-2012
Publisher
Institute of Electrical and Electronics Engineers Inc.
Keywords
Interfacial roughness; Multi-scale simulation; Silicon nanowires; TCAD
Citation
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD, pp.47 - 50
Indexed
SCOPUS
Journal Title
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
Start Page
47
End Page
50
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/164868
Abstract
Using a unique multi-scale simulation approach combining an atomic scale simulation of silicon nanowires (SiNWs) oxidation with an interfacial roughness characterization technique and the non-equilibrium Green's function (NEGF) calculation, the interfacial roughness effect on the transport characteristics was investigated. The calculated interfacial roughness, such as the root-mean-squared (RMS) roughness and correlation length was found to be in good agreement with the previous experimental work. The RMS roughness and correlation length increased linearly during the oxidation process. The NEGF calculation result revealed the decrease of the mobility with the increase of the charge density in the oxidized SiNW with 10 nm diameter.
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