Electrical test method using high density plasmas for high-end printed circuit boards
DC Field | Value | Language |
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dc.contributor.author | Oh, Se-Jin | - |
dc.contributor.author | Kim, Young-Cheol | - |
dc.contributor.author | Chung, Chin-Wook | - |
dc.date.accessioned | 2022-07-16T17:08:24Z | - |
dc.date.available | 2022-07-16T17:08:24Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2012-01 | - |
dc.identifier.issn | 0034-6748 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/166549 | - |
dc.description.abstract | A novel electrical test method that uses high-density plasmas, such as inductively coupled discharges, is proposed to detect open/short failures of high-end printed circuit boards (PCBs). The PCB is inserted into the plasma chamber with the top side facing the plasma sheath, and the bottom of the PCB is connected to the probe pin for the dc voltage bias and current measurements. A failure, including a latent open, can be precisely detected by biasing the dc voltage near the plasma potential due to the specific characteristics of the sheath formed on the PCB surface. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | AMER INST PHYSICS | - |
dc.title | Electrical test method using high density plasmas for high-end printed circuit boards | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Chung, Chin-Wook | - |
dc.identifier.doi | 10.1063/1.3676162 | - |
dc.identifier.scopusid | 2-s2.0-84859192644 | - |
dc.identifier.wosid | 000300594900026 | - |
dc.identifier.bibliographicCitation | REVIEW OF SCIENTIFIC INSTRUMENTS, v.83, no.1, pp.1 - 4 | - |
dc.relation.isPartOf | REVIEW OF SCIENTIFIC INSTRUMENTS | - |
dc.citation.title | REVIEW OF SCIENTIFIC INSTRUMENTS | - |
dc.citation.volume | 83 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 4 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | Electric discharges | - |
dc.subject.keywordPlus | Electric insulation testing | - |
dc.subject.keywordPlus | Electromagnetic induction | - |
dc.subject.keywordPlus | Organic pollutants | - |
dc.subject.keywordPlus | Plasma sheaths | - |
dc.subject.keywordPlus | Polychlorinated biphenyls | - |
dc.subject.keywordPlus | Printed circuit boards | - |
dc.subject.keywordPlus | DC voltage | - |
dc.subject.keywordPlus | Electrical tests | - |
dc.subject.keywordPlus | High density plasmas | - |
dc.subject.keywordPlus | Inductively coupled discharge | - |
dc.subject.keywordPlus | Plasma chambers | - |
dc.subject.keywordPlus | Plasma potential | - |
dc.identifier.url | https://aip.scitation.org/doi/10.1063/1.3676162 | - |
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