A system-on-package module by embedding a mobile TV IC in printed-circuit-board

Abstract

This paper presents a compact module for a mobile TV by using system-on-package (SoP) technology. In order to implement a slim and compact module, a mobile TV chip is embedded in printed-circuit-board (PCB) and other components are mounted in PCB. This module is composed of a mobile TV IC, a BPF, a crystal, regulators, shunt capacitors, and a loop filter. This module uses lamination process by using polymer substrates. Polymer substrate consists of epoxy core and ajimo-to-bonding film (ABF) to bond each layer. Three times lamination and via drill/Cu plated are proposed. Test method for an embedded IC is introduced and tested. DC bias, reference clock, PLL locking, and so on are measured. Two mobile TV modules by using surface mounting technology (SMT) and SoP technology are designed and compared. The size of module with SMT and SoP are as 6.8 mm 6.6 mm 0.9 mm and 4.7 mm 4.7 mm 1.0 mm, respectively. Almost 46 % size reduction is obtained by SoP. Rx sensitivity is measured as 89 dBm. As a result, a presented module shows the possibility of an embedded active IC, compact size, and good performance.