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Millisecond Flash Annealing as a Flatband Voltage Shift Enabler for p-Type Metal-Oxide-Semiconductor Devices with High-k/Metal Gate

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dc.contributor.authorChoi, Changhwan-
dc.contributor.authorNarayanan, Vijay-
dc.date.accessioned2022-07-16T22:23:39Z-
dc.date.available2022-07-16T22:23:39Z-
dc.date.created2021-05-12-
dc.date.issued2011-01-
dc.identifier.issn1099-0062-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/169291-
dc.description.abstractWe have investigated the effects of millisecond flash annealing (ms-FLA) on the electrical properties of p-type metal-oxide-semiconductor (pMOS) devices with high-k gate dielectrics with TiN gate. Compared to conventional rapid thermal annealing (RTA), ms-FLA improves pMOS characteristics such as positive flatband voltage (V-FB) shift along with scaled equivalent oxide thickness (EOT) and negligible gate leakage degradation, attributed to the suppressed oxygen vacancies [V-o(2+)] generation in high-k gate dielectrics due to a shorter thermal budget. Al-containing capping layers, TiN thickness, and Si cap deposition temperatures with ms-FLA substantially affect thermally generated [V-o(2+)], leading to different V-FB and EOT.-
dc.language영어-
dc.language.isoen-
dc.publisherELECTROCHEMICAL SOC INC-
dc.titleMillisecond Flash Annealing as a Flatband Voltage Shift Enabler for p-Type Metal-Oxide-Semiconductor Devices with High-k/Metal Gate-
dc.typeArticle-
dc.contributor.affiliatedAuthorChoi, Changhwan-
dc.identifier.doi10.1149/1.3566073-
dc.identifier.scopusid2-s2.0-79953779540-
dc.identifier.wosid000289165400023-
dc.identifier.bibliographicCitationELECTROCHEMICAL AND SOLID STATE LETTERS, v.14, no.6, pp.H241 - H243-
dc.relation.isPartOfELECTROCHEMICAL AND SOLID STATE LETTERS-
dc.citation.titleELECTROCHEMICAL AND SOLID STATE LETTERS-
dc.citation.volume14-
dc.citation.number6-
dc.citation.startPageH241-
dc.citation.endPageH243-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaElectrochemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryElectrochemistry-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusDielectric devices-
dc.subject.keywordPlusDielectric materials-
dc.subject.keywordPlusElectric properties-
dc.subject.keywordPlusGates (transistor)-
dc.subject.keywordPlusMetal analysis-
dc.subject.keywordPlusOxygen-
dc.subject.keywordPlusOxygen vacancies-
dc.subject.keywordPlusRapid thermal annealing-
dc.subject.keywordPlusRapid thermal processing-
dc.subject.keywordPlusTitanium nitride-
dc.subject.keywordPlusCap deposition-
dc.subject.keywordPlusCapping layer-
dc.subject.keywordPlusElectrical property-
dc.subject.keywordPlusEquivalent oxide thickness-
dc.subject.keywordPlusFlash annealing-
dc.subject.keywordPlusFlat-band voltage-
dc.subject.keywordPlusFlat-band voltage shift-
dc.subject.keywordPlusGate leakages-
dc.subject.keywordPlusHigh-k gate dielectrics-
dc.subject.keywordPlusMetal oxide semiconductor-
dc.subject.keywordPlusP-type-
dc.subject.keywordPlusThermal budget-
dc.subject.keywordPlusTiN gates-
dc.subject.keywordPlusGate dielectrics-
dc.identifier.urlhttps://iopscience.iop.org/article/10.1149/1.3566073-
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