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Substrate adhesion technique using thermosetting resin to apply roll-to-roll process to manufacturing of LCDs

Authors
Gwag, Jin-SeogHan, In-YungBae, Kwang-SooChoi, HongSohn, KyunghwaKim, Jae Hoon
Issue Date
Jul-2008
Publisher
Society for Information Display
Citation
Digest of Technical Papers - SID International Symposium, v.39, no.1, pp.1454 - 1456
Indexed
SCOPUS
Journal Title
Digest of Technical Papers - SID International Symposium
Volume
39
Number
1
Start Page
1454
End Page
1456
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/171971
DOI
10.1889/1.3069426
ISSN
0097-966X
Abstract
We developed novel substrate adhesion technique using thermosetting resin to apply roll-to-roll process to manufacturing of LCDs. We can use one-drop-filling (ODF) process without any distortion of LC alignment using the mixture of thermosetting resin and tetrahydrofuran(THF). This technique can be used to roll-to-roll process for flexible LCDs.
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COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)
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