Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer
DC Field | Value | Language |
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dc.contributor.author | Han, Won-Kyu | - |
dc.contributor.author | Hwang, Gil-Ho | - |
dc.contributor.author | Hong, Seok-Jun | - |
dc.contributor.author | Kim, Soo-Seok | - |
dc.contributor.author | Yoon, Chong-Seung | - |
dc.contributor.author | Kwak, Noh-Jung | - |
dc.contributor.author | Yeom, Seung-Jin | - |
dc.contributor.author | Kim, Jae-Hong | - |
dc.contributor.author | Kang, Sung-Goon | - |
dc.date.accessioned | 2022-12-20T23:06:55Z | - |
dc.date.available | 2022-12-20T23:06:55Z | - |
dc.date.created | 2022-08-26 | - |
dc.date.issued | 2009-03 | - |
dc.identifier.issn | 0167-9317 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177154 | - |
dc.description.abstract | We have developed a novel activation technique for the conformal electroless deposition (ELD) of Cu on a SiO2 substrate modified with an organic self-assembled monolayer. The SiO2 substrate was modified with amine groups using 3-aminopropyltriethoxysilane and Au nanoparticles (AuNPs) to form a uniform, continuous catalyst for ELD. The Au catalytic layer formed on the amine-SiO2 substrate was stabilized by electrostatic interactions between the positively charged protonated-amine self-assembled monolayer (SAM) and negatively charged AuNPs. Cu films were then electrolessly deposited on Au-catalyzed SiO2 substrates. The Cu seed layer formed by this method showed a highly conformal and continuous structure. Cu electrodeposition on the 60-nm trench was demonstrated using an acid cupric sulfate electrolyte containing chloride, polyethylene glycol 4000 and bis(3-sulfopropyl)disulfide. The resulting electroplated Cu showed excellent filling capability and no voids or other defects were observed in a 60-nm trench pattern. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER | - |
dc.title | Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Yoon, Chong-Seung | - |
dc.identifier.doi | 10.1016/j.mee.2008.11.024 | - |
dc.identifier.scopusid | 2-s2.0-59349113921 | - |
dc.identifier.wosid | 000264743100032 | - |
dc.identifier.bibliographicCitation | MICROELECTRONIC ENGINEERING, v.86, no.3, pp.374 - 378 | - |
dc.relation.isPartOf | MICROELECTRONIC ENGINEERING | - |
dc.citation.title | MICROELECTRONIC ENGINEERING | - |
dc.citation.volume | 86 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 374 | - |
dc.citation.endPage | 378 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Optics | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Optics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | THIN-FILMS | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | NANOPARTICLES | - |
dc.subject.keywordPlus | ELECTRODEPOSITION | - |
dc.subject.keywordPlus | SIZE | - |
dc.subject.keywordAuthor | Electrodeposition | - |
dc.subject.keywordAuthor | Self-assembled monolayer (SAM) | - |
dc.subject.keywordAuthor | Cu seed layer | - |
dc.subject.keywordAuthor | 60-nm trench pattern | - |
dc.identifier.url | https://www.sciencedirect.com/science/article/pii/S0167931708005480?via%3Dihub | - |
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