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Atomic-Level Investigation for Surface Characteristics in a Co-Cu Multilayer System: Molecular Dynamics Simulation

Authors
Kim, Byung-HyunChung, Yong-Chae
Issue Date
Nov-2008
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Co/Cu multilayer system; growth morphology; molecular dynamics simulation; thin films
Citation
IEEE TRANSACTIONS ON MAGNETICS, v.44, no.11, pp.2903 - 2906
Indexed
SCIE
SCOPUS
Journal Title
IEEE TRANSACTIONS ON MAGNETICS
Volume
44
Number
11
Start Page
2903
End Page
2906
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177738
DOI
10.1109/TMAG.2008.2001520
ISSN
0018-9464
Abstract
Using molecular dynamics simulation, the growth behavior of Co atoms on Cu substrates for two different crystallographic orientations, (001) and (111), was extensively investigated. The surface roughness became noticeably higher during 20-monolayer (ML) deposition of Co thin-film on the Cu(111) substrate compared to the case of the Cu(001) substrate. It was found that the high diffusivity of Co adatoms on Cu(111) enhanced the atomic lateral movement, and the deposited Co adatoms could be agglomerated easily. The different growth behavior could be successfully explained in terms of the lateral atomic displacement and local acceleration energy.
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