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Formation of Copper Based Nanoparticles Embedded in a Relatively Thick Polyimide Film by Thermal Curing in Reducing Atmosphere

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dc.contributor.authorYoon, Junro-
dc.contributor.authorChoi, Dongjoo-
dc.contributor.authorOh, Do-Hyun-
dc.contributor.authorKim, T. W.-
dc.contributor.authorKim, Young-Ho-
dc.date.accessioned2022-12-21T01:08:03Z-
dc.date.available2022-12-21T01:08:03Z-
dc.date.created2022-08-26-
dc.date.issued2008-10-
dc.identifier.issn1533-4880-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177845-
dc.description.abstractWe investigated the formation of nanoparticles in a relatively thick polyimide (PI) film (>1 mu m) in controlled atmospheres and optical properties of these nanoparticles. Polyamic acid of 10 wt% BPDA-PDA was spin-coated on the 25 nm Cu thin film and thermally cured at 350 degrees C in high purity nitrogen or 5% H-2 + 95% N-2 atmosphere. The fabricated nanoparticles in high purity nitrogen atmosphere had spherical shape and were dispersed in the 1.5 mu m thick PI film. Its phase was revealed as Cu and Cuprous Oxide by X-ray diffraction (XRD). Its size and optical absorption depended on deposited metal thin film thickness. After post heat-treatment in 5% H-2 + 95% N-2 atmosphere, surface plasmon resonance from metallic Cu nanoparticle was enhanced. In the specimens cured in reducing atmosphere, 5% H-2 + 95% N-2, highly dense and 3.5 nm size nanoparticles were well dispersed in an entire PI film. XRD results and optical data revealed that nanoparticles fabricated in 5% H-2 + 95% N-2 atmosphere were metallic Cu. Thermal curing in reducing atmosphere produces nanoparticles of high density, and uniform dispersion in a relatively thick PI film.-
dc.language영어-
dc.language.isoen-
dc.publisherAMER SCIENTIFIC PUBLISHERS-
dc.titleFormation of Copper Based Nanoparticles Embedded in a Relatively Thick Polyimide Film by Thermal Curing in Reducing Atmosphere-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, T. W.-
dc.contributor.affiliatedAuthorKim, Young-Ho-
dc.identifier.doi10.1166/jnn.2008.1100-
dc.identifier.scopusid2-s2.0-58149265805-
dc.identifier.wosid000261390500111-
dc.identifier.bibliographicCitationJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.8, no.10, pp.5433 - 5438-
dc.relation.isPartOfJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY-
dc.citation.titleJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY-
dc.citation.volume8-
dc.citation.number10-
dc.citation.startPage5433-
dc.citation.endPage5438-
dc.type.rimsART-
dc.type.docTypeArticle; Proceedings Paper-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryChemistry, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusCopper oxides-
dc.subject.keywordPlusCuring-
dc.subject.keywordPlusEarth atmosphere-
dc.subject.keywordPlusHeat treating furnaces-
dc.subject.keywordPlusMetallic soaps-
dc.subject.keywordPlusNanoparticles-
dc.subject.keywordPlusOptical properties-
dc.subject.keywordPlusPolyimides-
dc.subject.keywordPlusPolymers-
dc.subject.keywordPlusSurface plasmon resonance-
dc.subject.keywordPlusSurface treatment-
dc.subject.keywordPlusThin film devices-
dc.subject.keywordPlusThin films-
dc.subject.keywordPlusX ray analysis-
dc.subject.keywordPlusX ray diffraction analysis-
dc.subject.keywordAuthorMetallic Cu Nanoparticles-
dc.subject.keywordAuthorThermal Curing in Reducing Atmosphere-
dc.subject.keywordAuthorPost Heat-Treatment-
dc.identifier.urlhttps://www.ingentaconnect.com/content/asp/jnn/2008/00000008/00000010/art00111-
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서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles

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