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Formation of Copper Based Nanoparticles Embedded in a Relatively Thick Polyimide Film by Thermal Curing in Reducing Atmosphere
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoon, Junro | - |
| dc.contributor.author | Choi, Dongjoo | - |
| dc.contributor.author | Oh, Do-Hyun | - |
| dc.contributor.author | Kim, T. W. | - |
| dc.contributor.author | Kim, Young-Ho | - |
| dc.date.accessioned | 2022-12-21T01:08:03Z | - |
| dc.date.available | 2022-12-21T01:08:03Z | - |
| dc.date.issued | 2008-10 | - |
| dc.identifier.issn | 1533-4880 | - |
| dc.identifier.issn | 1533-4899 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177845 | - |
| dc.description.abstract | We investigated the formation of nanoparticles in a relatively thick polyimide (PI) film (>1 mu m) in controlled atmospheres and optical properties of these nanoparticles. Polyamic acid of 10 wt% BPDA-PDA was spin-coated on the 25 nm Cu thin film and thermally cured at 350 degrees C in high purity nitrogen or 5% H-2 + 95% N-2 atmosphere. The fabricated nanoparticles in high purity nitrogen atmosphere had spherical shape and were dispersed in the 1.5 mu m thick PI film. Its phase was revealed as Cu and Cuprous Oxide by X-ray diffraction (XRD). Its size and optical absorption depended on deposited metal thin film thickness. After post heat-treatment in 5% H-2 + 95% N-2 atmosphere, surface plasmon resonance from metallic Cu nanoparticle was enhanced. In the specimens cured in reducing atmosphere, 5% H-2 + 95% N-2, highly dense and 3.5 nm size nanoparticles were well dispersed in an entire PI film. XRD results and optical data revealed that nanoparticles fabricated in 5% H-2 + 95% N-2 atmosphere were metallic Cu. Thermal curing in reducing atmosphere produces nanoparticles of high density, and uniform dispersion in a relatively thick PI film. | - |
| dc.format.extent | 6 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | American Scientific Publishers | - |
| dc.title | Formation of Copper Based Nanoparticles Embedded in a Relatively Thick Polyimide Film by Thermal Curing in Reducing Atmosphere | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1166/jnn.2008.1100 | - |
| dc.identifier.scopusid | 2-s2.0-58149265805 | - |
| dc.identifier.wosid | 000261390500111 | - |
| dc.identifier.bibliographicCitation | Journal of Nanoscience and Nanotechnology, v.8, no.10, pp 5433 - 5438 | - |
| dc.citation.title | Journal of Nanoscience and Nanotechnology | - |
| dc.citation.volume | 8 | - |
| dc.citation.number | 10 | - |
| dc.citation.startPage | 5433 | - |
| dc.citation.endPage | 5438 | - |
| dc.type.docType | Article; Proceedings Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Chemistry | - |
| dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
| dc.subject.keywordPlus | Copper oxides | - |
| dc.subject.keywordPlus | Curing | - |
| dc.subject.keywordPlus | Earth atmosphere | - |
| dc.subject.keywordPlus | Heat treating furnaces | - |
| dc.subject.keywordPlus | Metallic soaps | - |
| dc.subject.keywordPlus | Nanoparticles | - |
| dc.subject.keywordPlus | Optical properties | - |
| dc.subject.keywordPlus | Polyimides | - |
| dc.subject.keywordPlus | Polymers | - |
| dc.subject.keywordPlus | Surface plasmon resonance | - |
| dc.subject.keywordPlus | Surface treatment | - |
| dc.subject.keywordPlus | Thin film devices | - |
| dc.subject.keywordPlus | Thin films | - |
| dc.subject.keywordPlus | X ray analysis | - |
| dc.subject.keywordPlus | X ray diffraction analysis | - |
| dc.subject.keywordAuthor | Metallic Cu Nanoparticles | - |
| dc.subject.keywordAuthor | Thermal Curing in Reducing Atmosphere | - |
| dc.subject.keywordAuthor | Post Heat-Treatment | - |
| dc.identifier.url | https://www.ingentaconnect.com/content/asp/jnn/2008/00000008/00000010/art00111 | - |
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