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Formation of Copper Based Nanoparticles Embedded in a Relatively Thick Polyimide Film by Thermal Curing in Reducing Atmosphere

Authors
Yoon, JunroChoi, DongjooOh, Do-HyunKim, T. W.Kim, Young-Ho
Issue Date
Oct-2008
Publisher
AMER SCIENTIFIC PUBLISHERS
Keywords
Metallic Cu Nanoparticles; Thermal Curing in Reducing Atmosphere; Post Heat-Treatment
Citation
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.8, no.10, pp.5433 - 5438
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume
8
Number
10
Start Page
5433
End Page
5438
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177845
DOI
10.1166/jnn.2008.1100
ISSN
1533-4880
Abstract
We investigated the formation of nanoparticles in a relatively thick polyimide (PI) film (>1 mu m) in controlled atmospheres and optical properties of these nanoparticles. Polyamic acid of 10 wt% BPDA-PDA was spin-coated on the 25 nm Cu thin film and thermally cured at 350 degrees C in high purity nitrogen or 5% H-2 + 95% N-2 atmosphere. The fabricated nanoparticles in high purity nitrogen atmosphere had spherical shape and were dispersed in the 1.5 mu m thick PI film. Its phase was revealed as Cu and Cuprous Oxide by X-ray diffraction (XRD). Its size and optical absorption depended on deposited metal thin film thickness. After post heat-treatment in 5% H-2 + 95% N-2 atmosphere, surface plasmon resonance from metallic Cu nanoparticle was enhanced. In the specimens cured in reducing atmosphere, 5% H-2 + 95% N-2, highly dense and 3.5 nm size nanoparticles were well dispersed in an entire PI film. XRD results and optical data revealed that nanoparticles fabricated in 5% H-2 + 95% N-2 atmosphere were metallic Cu. Thermal curing in reducing atmosphere produces nanoparticles of high density, and uniform dispersion in a relatively thick PI film.
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서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles

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