Formation of Copper Based Nanoparticles Embedded in a Relatively Thick Polyimide Film by Thermal Curing in Reducing Atmosphere
- Authors
- Yoon, Junro; Choi, Dongjoo; Oh, Do-Hyun; Kim, T. W.; Kim, Young-Ho
- Issue Date
- Oct-2008
- Publisher
- American Scientific Publishers
- Keywords
- Metallic Cu Nanoparticles; Thermal Curing in Reducing Atmosphere; Post Heat-Treatment
- Citation
- Journal of Nanoscience and Nanotechnology, v.8, no.10, pp 5433 - 5438
- Pages
- 6
- Indexed
- SCIE
SCOPUS
- Journal Title
- Journal of Nanoscience and Nanotechnology
- Volume
- 8
- Number
- 10
- Start Page
- 5433
- End Page
- 5438
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177845
- DOI
- 10.1166/jnn.2008.1100
- ISSN
- 1533-4880
1533-4899
- Abstract
- We investigated the formation of nanoparticles in a relatively thick polyimide (PI) film (>1 mu m) in controlled atmospheres and optical properties of these nanoparticles. Polyamic acid of 10 wt% BPDA-PDA was spin-coated on the 25 nm Cu thin film and thermally cured at 350 degrees C in high purity nitrogen or 5% H-2 + 95% N-2 atmosphere. The fabricated nanoparticles in high purity nitrogen atmosphere had spherical shape and were dispersed in the 1.5 mu m thick PI film. Its phase was revealed as Cu and Cuprous Oxide by X-ray diffraction (XRD). Its size and optical absorption depended on deposited metal thin film thickness. After post heat-treatment in 5% H-2 + 95% N-2 atmosphere, surface plasmon resonance from metallic Cu nanoparticle was enhanced. In the specimens cured in reducing atmosphere, 5% H-2 + 95% N-2, highly dense and 3.5 nm size nanoparticles were well dispersed in an entire PI film. XRD results and optical data revealed that nanoparticles fabricated in 5% H-2 + 95% N-2 atmosphere were metallic Cu. Thermal curing in reducing atmosphere produces nanoparticles of high density, and uniform dispersion in a relatively thick PI film.
- Files in This Item
-
Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
- 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.