Thermal Stability of Cu and Cu2O Nanoparticles in a Polyimide Film
- Authors
- Choi, Jae-Youn; Dong, Wenguo; Choi, Dong Joo; Yoon, Chong S.; Kim, Young-Ho
- Issue Date
- Sep-2008
- Publisher
- AMER SCIENTIFIC PUBLISHERS
- Keywords
- Nanoparticles; Polyimide; Imidization; Stability
- Citation
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.8, no.9, pp.4822 - 4825
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
- Volume
- 8
- Number
- 9
- Start Page
- 4822
- End Page
- 4825
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177989
- DOI
- 10.1166/jnn.2008.IC14
- ISSN
- 1533-4880
- Abstract
- Nanoparticles of Cu or Cu oxide dispersed in a polyimide (PI) film were fabricated by reaction of polyamic acid with a thin Cu film during imidization. In this paper, the thermal stability of the Cu or Cu oxide nanoparticles was investigated under various atmospheres. The PI/nanoparticle composites were heat-treated at 140 degrees C and 250 degrees C in air, N-2, Ar, and 5% H-2 atmospheres. Nanoparticles in the PI film were characterized by UV-VIS spectroscopy and transmission electron microscopy. The optical absorption peaks originating from Cu or Cu2O nanoparticles were changed by heat-treatment in different atmospheres. When Cu nanoparticles were oxidized by heat-treatment in air, the surface plasmon resonance (SPR) peak originating from the Cu nanoparticles disappeared. The quantum confined absorption peak of Cu2O was not affected by heat-treatment in N-2 or Ar. Cu2O nanoparticles were reduced by heat-treatment at 250 C in 5% H-2 atmosphere and a new SPR peak appeared. Our results show that Cu nanoparticles are easily oxidized and highly dense Cu nanoparticles can be formed by reducing Cu2O nanoparticles.
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