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Thermal Stability of Cu and Cu2O Nanoparticles in a Polyimide Film

Authors
Choi, Jae-YounDong, WenguoChoi, Dong JooYoon, Chong S.Kim, Young-Ho
Issue Date
Sep-2008
Publisher
AMER SCIENTIFIC PUBLISHERS
Keywords
Nanoparticles; Polyimide; Imidization; Stability
Citation
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.8, no.9, pp.4822 - 4825
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume
8
Number
9
Start Page
4822
End Page
4825
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/177989
DOI
10.1166/jnn.2008.IC14
ISSN
1533-4880
Abstract
Nanoparticles of Cu or Cu oxide dispersed in a polyimide (PI) film were fabricated by reaction of polyamic acid with a thin Cu film during imidization. In this paper, the thermal stability of the Cu or Cu oxide nanoparticles was investigated under various atmospheres. The PI/nanoparticle composites were heat-treated at 140 degrees C and 250 degrees C in air, N-2, Ar, and 5% H-2 atmospheres. Nanoparticles in the PI film were characterized by UV-VIS spectroscopy and transmission electron microscopy. The optical absorption peaks originating from Cu or Cu2O nanoparticles were changed by heat-treatment in different atmospheres. When Cu nanoparticles were oxidized by heat-treatment in air, the surface plasmon resonance (SPR) peak originating from the Cu nanoparticles disappeared. The quantum confined absorption peak of Cu2O was not affected by heat-treatment in N-2 or Ar. Cu2O nanoparticles were reduced by heat-treatment at 250 C in 5% H-2 atmosphere and a new SPR peak appeared. Our results show that Cu nanoparticles are easily oxidized and highly dense Cu nanoparticles can be formed by reducing Cu2O nanoparticles.
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