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Effect of characteristics of nano-colloidal silica abrasives on wafer surface roughness for wafer touch polishing
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Jin-Hyung | - |
| dc.contributor.author | Paik, Ungyu | - |
| dc.contributor.author | Park, Jea-Gun | - |
| dc.date.accessioned | 2022-12-21T07:33:46Z | - |
| dc.date.available | 2022-12-21T07:33:46Z | - |
| dc.date.created | 2022-09-16 | - |
| dc.date.issued | 2007-06 | - |
| dc.identifier.issn | 1012-0394 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180003 | - |
| dc.description.abstract | The purpose of this study is to reveal the mechanism of wafer touch polishing by high purity colloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). The effect of surfactant concentration on wafer touch polishing was studied with the aim of improving roughness on wafer surface after polishing. As a result, the level of haze and micro-roughness are decreased with the decrease of surfactant concentration. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | Trans Tech Publications Ltd | - |
| dc.title | Effect of characteristics of nano-colloidal silica abrasives on wafer surface roughness for wafer touch polishing | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Paik, Ungyu | - |
| dc.contributor.affiliatedAuthor | Park, Jea-Gun | - |
| dc.identifier.doi | 10.4028/www.scientific.net/SSP.121-123.1229 | - |
| dc.identifier.scopusid | 2-s2.0-38549139448 | - |
| dc.identifier.bibliographicCitation | Solid State Phenomena, v.121-123, no.PART 2, pp.1229 - 1232 | - |
| dc.relation.isPartOf | Solid State Phenomena | - |
| dc.citation.title | Solid State Phenomena | - |
| dc.citation.volume | 121-123 | - |
| dc.citation.number | PART 2 | - |
| dc.citation.startPage | 1229 | - |
| dc.citation.endPage | 1232 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Conference Paper | - |
| dc.description.journalClass | 1 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.subject.keywordPlus | Abrasives | - |
| dc.subject.keywordPlus | Concentration (process) | - |
| dc.subject.keywordPlus | Polishing | - |
| dc.subject.keywordPlus | Silicon wafers | - |
| dc.subject.keywordPlus | Slurries | - |
| dc.subject.keywordPlus | Surface active agents | - |
| dc.subject.keywordPlus | Surface roughness | - |
| dc.subject.keywordPlus | Haze | - |
| dc.subject.keywordPlus | Non-ionic surfactant | - |
| dc.subject.keywordPlus | Wafer polishing | - |
| dc.subject.keywordPlus | Silica | - |
| dc.subject.keywordAuthor | Haze | - |
| dc.subject.keywordAuthor | Non-ionic surfactant | - |
| dc.subject.keywordAuthor | Roughness | - |
| dc.subject.keywordAuthor | Slurry | - |
| dc.subject.keywordAuthor | Wafer polishing | - |
| dc.identifier.url | https://www.scientific.net/SSP.121-123.1229 | - |
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)