Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Effect of characteristics of nano-colloidal silica abrasives on wafer surface roughness for wafer touch polishing
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Jin-Hyung | - |
| dc.contributor.author | Paik, Ungyu | - |
| dc.contributor.author | Park, Jea-Gun | - |
| dc.date.accessioned | 2022-12-21T07:33:46Z | - |
| dc.date.available | 2022-12-21T07:33:46Z | - |
| dc.date.issued | 2007-06 | - |
| dc.identifier.issn | 1012-0394 | - |
| dc.identifier.issn | 1662-9779 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180003 | - |
| dc.description.abstract | The purpose of this study is to reveal the mechanism of wafer touch polishing by high purity colloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). The effect of surfactant concentration on wafer touch polishing was studied with the aim of improving roughness on wafer surface after polishing. As a result, the level of haze and micro-roughness are decreased with the decrease of surfactant concentration. | - |
| dc.format.extent | 4 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | Scitec Publications Ltd. | - |
| dc.title | Effect of characteristics of nano-colloidal silica abrasives on wafer surface roughness for wafer touch polishing | - |
| dc.type | Article | - |
| dc.publisher.location | 스위스 | - |
| dc.identifier.doi | 10.4028/www.scientific.net/SSP.121-123.1229 | - |
| dc.identifier.scopusid | 2-s2.0-38549139448 | - |
| dc.identifier.bibliographicCitation | Solid State Phenomena, v.121-123, no.PART 2, pp 1229 - 1232 | - |
| dc.citation.title | Solid State Phenomena | - |
| dc.citation.volume | 121-123 | - |
| dc.citation.number | PART 2 | - |
| dc.citation.startPage | 1229 | - |
| dc.citation.endPage | 1232 | - |
| dc.type.docType | Conference Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.subject.keywordPlus | Abrasives | - |
| dc.subject.keywordPlus | Concentration (process) | - |
| dc.subject.keywordPlus | Polishing | - |
| dc.subject.keywordPlus | Silicon wafers | - |
| dc.subject.keywordPlus | Slurries | - |
| dc.subject.keywordPlus | Surface active agents | - |
| dc.subject.keywordPlus | Surface roughness | - |
| dc.subject.keywordPlus | Haze | - |
| dc.subject.keywordPlus | Non-ionic surfactant | - |
| dc.subject.keywordPlus | Wafer polishing | - |
| dc.subject.keywordPlus | Silica | - |
| dc.subject.keywordAuthor | Haze | - |
| dc.subject.keywordAuthor | Non-ionic surfactant | - |
| dc.subject.keywordAuthor | Roughness | - |
| dc.subject.keywordAuthor | Slurry | - |
| dc.subject.keywordAuthor | Wafer polishing | - |
| dc.identifier.url | https://www.scientific.net/SSP.121-123.1229 | - |
- Files in This Item
- Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
- 서울 공과대학 > 서울 에너지공학과 > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)