Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Effect of characteristics of nano-colloidal silica abrasives on wafer surface roughness for wafer touch polishing
- Authors
- Park, Jin-Hyung; Paik, Ungyu; Park, Jea-Gun
- Issue Date
- Jun-2007
- Publisher
- Trans Tech Publications Ltd
- Keywords
- Haze; Non-ionic surfactant; Roughness; Slurry; Wafer polishing
- Citation
- Solid State Phenomena, v.121-123, no.PART 2, pp.1229 - 1232
- Indexed
- SCOPUS
- Journal Title
- Solid State Phenomena
- Volume
- 121-123
- Number
- PART 2
- Start Page
- 1229
- End Page
- 1232
- ISSN
- 1012-0394
- Abstract
- The purpose of this study is to reveal the mechanism of wafer touch polishing by high purity colloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). The effect of surfactant concentration on wafer touch polishing was studied with the aim of improving roughness on wafer surface after polishing. As a result, the level of haze and micro-roughness are decreased with the decrease of surfactant concentration.
- Files in This Item
- Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
- 서울 공과대학 > 서울 에너지공학과 > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Park, Jea Gun
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)