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High-K and low loss Bi1.5Zn1.0Nb1.5O 7/polyimide composite films for application in embedded capacitors

Authors
Choi, Seung-HoonKim, Il-DooHong, Jae-MinOh, Seong-Geun
Issue Date
Mar-2007
Publisher
Wiley-Blackwell
Keywords
BZN; Capacitors; Dielectric properties; Embedded; Polyimides
Citation
Macromolecular Symposia, v.249-250, pp.241 - 246
Indexed
SCOPUS
Journal Title
Macromolecular Symposia
Volume
249-250
Start Page
241
End Page
246
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180350
DOI
10.1002/masy.200750339
ISSN
1022-1360
Abstract
We report on the role of Bi1.5Zn1.0Nb 1.5O7 (BZN) ceramic fillers in notably reducing the dielectric loss of BZN/polyimide composite films manufactured for application in flexible RF embedded capacitors. The composite films were synthesized using a colloidal process. INAAT (isopropyl tris(N-amino-ethyl aminoethyl)titanate) was used as a coupling agent for homogeneous dispersion of BZN particles into a polyimide matrix. The BZN/polyimide composite films (BZN content at 50 Vol%) exhibited a low dielectric loss of 0.0369 at 12 MHz while retaining a high dielectric constant of 14.75.
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