Optical integrated circuits and networks on micro/nano-scale
- Authors
- Lee, El-Hang; Lee, Seunggol; O, Beom Hoan; Park, Segeun; Kim, Kyonghon; Song, Seok Ho
- Issue Date
- Jan-2007
- Publisher
- SPIE
- Keywords
- Nano-photonics; Optical interconnection; Optical printed circuit board; Photonic crystal; Photonic integration; Plasmonics; VLSI photonics
- Citation
- Proceedings of SPIE - The International Society for Optical Engineering, v.6476
- Indexed
- SCOPUS
- Journal Title
- Proceedings of SPIE - The International Society for Optical Engineering
- Volume
- 6476
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180537
- DOI
- 10.1117/12.707279
- ISSN
- 0277-786X
- Abstract
- We present an overview of our work on the design and fabrication of micro/nano-scale photonic circuits and networks on what we call optical printed circuit boards (O-PCBs) and VLSI photonic integrated circuit chips(VLSI-PICs) of generic and application-specific nature. The O-PCBs and photonic chips consist of 2-dimensional planar arrays of optical wires, circuits, and networks of micro/nano-scale to perform the functions of sensing, storing, transporting, processing, switching, routing, and distributing optical signals on flat boards or chips. We describe and discuss scientific and technological issues concerning the miniaturization, interconnection and integration of micro/nano-scale photonic devices, circuits, and networks leading to small and very large scale integration in terms of photonic scaling rules and discuss their use for the design and fabrication of the photonic integrated circuits and networks. Design rules for the miniaturization and integration of the micro/nano-photonic systems are discussed in comparison with those of the micro/nano-electronic systems. Materials include polymer/organic materials and silicon materials. Structural bases include photonic crystals, ring resonators, and plasmonic structures. Compatibility issues between diverse materials and devices are discussed especially in regard to applications. Recent progresses and examples are presented.
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