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Fabrication of Cu/Co bilayer gate electrodes using selective chemical vapor deposition and soft lithographic patterning

Authors
Yang, HeejungLee, Jang-SikKim, SihyeongKo, YeonkyuShin, HyunjungLee, JaegabKim, Chul S.Sung, Myung MoBae, YanghoCho, BeomseokBae, YanghoLee, JunghyoungKim, DohyunJeong, ChangohKim, Sam Y.Lim, Soonkwon
Issue Date
Dec-2006
Publisher
AMER INST PHYSICS
Citation
JOURNAL OF APPLIED PHYSICS, v.100, no.11
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF APPLIED PHYSICS
Volume
100
Number
11
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180695
DOI
10.1063/1.2396796
ISSN
0021-8979
Abstract
A templated Cu/Co bilayer gate electrode was fabricated using the combined method of consecutive and selective chemical vapor deposition (CVD), and octadecyltrichlorosilane (OTS) microcontact printing techniques. Soft lithographically patterned self-assembled monolayers (SAMs) can direct the growth of Co occurring at the low temperatures 50-90 degrees C and serve as a template for the consecutive and selective growth of Cu, thereby forming stable and high quality Cu/Co bilayer gate electrodes on a glass substrate. This simple process provides fewer process steps and higher performance than other conventional processes, and can be applied to the fabrication of large area and high resolution thin film transistor liquid crystal displays.
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