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The influence of annealing temperature on the microstructural development of W-Cu composite powder prepared by high-energy ball milling

Authors
Ryu, Sung-SooKim, Gil-SuKim, Jin-ChunOh, Sung-TagDo Kim, Young
Issue Date
Nov-2006
Publisher
ELSEVIER SCIENCE SA
Keywords
nanocrystalline W-Cu powders; annealing temperature; microstructure
Citation
JOURNAL OF ALLOYS AND COMPOUNDS, v.424, no.1-2, pp.209 - 212
Indexed
SCIE
SCOPUS
Journal Title
JOURNAL OF ALLOYS AND COMPOUNDS
Volume
424
Number
1-2
Start Page
209
End Page
212
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180789
DOI
10.1016/j.jallcom.2005.10.082
ISSN
0925-8388
Abstract
The microstructural characteristics of nanocrystalline W-Cu powder mixture were investigated as functions of annealing temperature. Open pores were observed after an annealing treatment at 300 degrees C, indicating that the pores that had entrapped as-milled powder opened. As the annealing temperature increased, the mean pore size increased and the pore size distribution broadened. The powder mixtures annealed above 500 degrees C showed significant differences in pore size distribution, powder density, and specific surface area. The changes in the powder characteristics were explained by Cu segregation and W grain growth due to the liquid-like behavior of Cu.
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