The influence of annealing temperature on the microstructural development of W-Cu composite powder prepared by high-energy ball milling
- Authors
- Ryu, Sung-Soo; Kim, Gil-Su; Kim, Jin-Chun; Oh, Sung-Tag; Do Kim, Young
- Issue Date
- Nov-2006
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- nanocrystalline W-Cu powders; annealing temperature; microstructure
- Citation
- JOURNAL OF ALLOYS AND COMPOUNDS, v.424, no.1-2, pp.209 - 212
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF ALLOYS AND COMPOUNDS
- Volume
- 424
- Number
- 1-2
- Start Page
- 209
- End Page
- 212
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180789
- DOI
- 10.1016/j.jallcom.2005.10.082
- ISSN
- 0925-8388
- Abstract
- The microstructural characteristics of nanocrystalline W-Cu powder mixture were investigated as functions of annealing temperature. Open pores were observed after an annealing treatment at 300 degrees C, indicating that the pores that had entrapped as-milled powder opened. As the annealing temperature increased, the mean pore size increased and the pore size distribution broadened. The powder mixtures annealed above 500 degrees C showed significant differences in pore size distribution, powder density, and specific surface area. The changes in the powder characteristics were explained by Cu segregation and W grain growth due to the liquid-like behavior of Cu.
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