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Comparison of Biot Savart simulation and 3D finite element simulation of the electromagnetic forces acting on end windings of electrical machines

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dc.contributor.authorKim, Ki-Chan-
dc.contributor.authorLee, Ju-
dc.date.accessioned2022-12-21T11:19:09Z-
dc.date.available2022-12-21T11:19:09Z-
dc.date.created2022-09-16-
dc.date.issued2006-05-
dc.identifier.issn0000-0000-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/181467-
dc.description.abstractIn this paper, we analyzed the distribution of electromagnetic force acting on the end winding by Biot Savart's law and 3D finite element method (FEM). We studied these methods analytically and compared the force distribution of two methods.-
dc.language영어-
dc.language.isoen-
dc.publisherIEEE Computer Society-
dc.titleComparison of Biot Savart simulation and 3D finite element simulation of the electromagnetic forces acting on end windings of electrical machines-
dc.typeArticle-
dc.contributor.affiliatedAuthorLee, Ju-
dc.identifier.doi10.1109/CEFC-06.2006.1632894-
dc.identifier.scopusid2-s2.0-42749100445-
dc.identifier.bibliographicCitation12th Biennial IEEE Conference on Electromagnetic Field Computation, CEFC 2006, pp.102 - 102-
dc.relation.isPartOf12th Biennial IEEE Conference on Electromagnetic Field Computation, CEFC 2006-
dc.citation.title12th Biennial IEEE Conference on Electromagnetic Field Computation, CEFC 2006-
dc.citation.startPage102-
dc.citation.endPage102-
dc.type.rimsART-
dc.type.docTypeConference Paper-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordPlusComputer simulation-
dc.subject.keywordPlusElectric machinery-
dc.subject.keywordPlusElectromagnetic fields-
dc.subject.keywordPlusThree dimensional computer graphics-
dc.subject.keywordPlusWinding-
dc.subject.keywordPlusBiot Savart simulation-
dc.subject.keywordPlusElectromagnetic forces-
dc.subject.keywordPlusEnd winding-
dc.subject.keywordPlusFinite element method-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/1632894/-
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