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Scaling of equivalent oxide thickness of atomic layer deposited HfO2 film using RuO2 electrodes suppressing the dielectric dead-layer effect

Authors
Kim, Hyo KyeomYu, Il-HyukLee, Jae HoPark, Tae JooHwang, Cheol Seong
Issue Date
Oct-2012
Publisher
AMER INST PHYSICS
Keywords
THIN-FILMS; CAPACITORS
Citation
APPLIED PHYSICS LETTERS, v.101, no.17, pp.1 - 6
Indexed
SCIE
SCOPUS
Journal Title
APPLIED PHYSICS LETTERS
Volume
101
Number
17
Start Page
1
End Page
6
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/181955
DOI
10.1063/1.4764541
ISSN
0003-6951
Abstract
The influences of RuO2 metal gate on the dielectric performance of high-k HfO2 film on Si substrate were examined. The equivalent oxide thickness (EOT) of HfO2 film can be scaled down by similar to 0.5 nm in the EOT range from 0.8 to 2.5 nm compared with the standard Pt gate case. This was attributed to the suppression of the dielectric dead-layer effect at the HfO2/RuO2 interface due to the possible ionic polarization of RuO2 within the screening length of the electrode. The estimated work function of RuO2 on HfO2 is similar to 5.0 eV suggesting the appropriateness of RuO2 for p-transistor. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4764541]
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