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Galvanic displacement of BixTey thin films from sacrificial iron group thin films

Authors
Chang, Chong HyunRheem, YoungwooChoa, Yong-HoPark, Deok-YongMyung, Nosang V.
Issue Date
Jan-2010
Publisher
Pergamon Press Ltd.
Keywords
Electrochemical process; Galvanic displacement; Bismuth telluride; Thin films; Thermoelectric materials; Semiconducting materials
Citation
Electrochimica Acta, v.55, no.3, pp.1072 - 1080
Indexed
SCIE
SCOPUS
Journal Title
Electrochimica Acta
Volume
55
Number
3
Start Page
1072
End Page
1080
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/181999
DOI
10.1016/j.electacta.2009.09.066
ISSN
0013-4686
Abstract
BixTey thin films synthesized by galvanic displacement were systematically investigated by observing open circuit potential (OCP), surface morphology, microstructure and film composition. Surface morphologies and crystal structures of synthesized BixTey thin films were strongly depended on the type of the sacrificial materials (i.e., nickel (Ni), cobalt (Co) and iron (Fe)). Galvanically deposited BixTey thin films from the sacrificial Ni and Co thin films exhibited Bi2Te3 intermetallic compounds and hierarchical structures with backbones and sub-branches. A linear relationship of deposited Bi content in BixTey thin films as a function of [Bi3+]/[HTeO2+] ratio (within a range of less than 0.8) in the electrolyte was also observed. Surface morphologies of BixTey thin films were altered with the film composition. (C) 2009 Elsevier Ltd. All rights reserved.
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