Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Reduced Metal Contamination in Atomic-Layer-Deposited HfO2 Films Grown on Si Using O-3 Oxidant Generated Without N-2 Assistance
- Issue Date
- May-2010
- Publisher
- ELECTROCHEMICAL SOC INC
- Keywords
- atomic layer deposition; dielectric thin films; electric breakdown; elemental semiconductors; etching; hafnium compounds; impurities; oxidation; silicon; stainless steel
- Citation
- ELECTROCHEMICAL AND SOLID STATE LETTERS, v.13, no.8, pp.G65 - G67
- Indexed
- SCIE
SCOPUS
- Journal Title
- ELECTROCHEMICAL AND SOLID STATE LETTERS
- Volume
- 13
- Number
- 8
- Start Page
- G65
- End Page
- G67
- ISSN
- 1099-0062
- Abstract
- The physicochemical and electrical properties of atomic-layer-deposited HfO2 films grown using O-3 generated with and without N-2 assistance were examined. Compared to the films grown using conventionally generated O-3 with N-2 assistance, the HfO2 film grown using O-3 generated without N-2 assistance had less metal impurities (mainly Cr) possibly due to the etching of stainless ozone delivery line. This induced a higher physical density of the film and a lower Si concentration in the film, which resulted in enhanced dielectric properties and reliability such as dielectric breakdown and resistance to constant voltage stress. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3430657] All rights reserved.
- Files in This Item
- Go to Link
- Appears in
Collections - ETC > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.