Improved Adhesion of Metal Electrode Layer on Si3N4 Substrate through an All-Wet Process
DC Field | Value | Language |
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dc.contributor.author | Kim, Danbi | - |
dc.contributor.author | Eom, Nu Si A. | - |
dc.contributor.author | Kim, Jiwon | - |
dc.contributor.author | Lee, Kyu Hyoung | - |
dc.contributor.author | Park, Sung Heum | - |
dc.contributor.author | Lee, Ju Ho | - |
dc.contributor.author | Chao, Yong-Ho | - |
dc.contributor.author | Lim, Jae-Hong | - |
dc.date.accessioned | 2022-12-22T02:33:32Z | - |
dc.date.available | 2022-12-22T02:33:32Z | - |
dc.date.created | 2021-01-21 | - |
dc.date.issued | 2019-03 | - |
dc.identifier.issn | 2162-8769 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/182090 | - |
dc.description.abstract | Electroless deposition requires preliminary surface treatment to effectively adsorb a metal electrode layer onto a ceramic substrate. Herein, a simple surface treatment using an all-wet process was performed to achieve adhesion stability between a Si3N4 substrate and Ni film. The method involved deposition of an interfacial Pd-TiO2 buffer between the two layers. Surface pretreatment via silanization was initially performed to improve surface wettability, thereby enhancing uniform deposition of Pd-TiO2. Subsequently, a thin Ni layer was directly deposited onto the Pd-TiO2 layer without necessitating sensitization or activation. The synthesized Ni/Pd-TiO2/Si3N4 heat sink exhibited excellent adhesion property in the cross-hatch, scratch, and thermal shock tests. The mechanism of adhesion enhancement involved chemical bonding of Pd-TiO2 with the self-assembled monolayer on the substrate and reduced internal stress due to removal of residual hydrogen between the layers of the heat sink. Thus, the fabricated heat sink has a promising application in electronic devices operated at high temperatures. (C) 2019 The Electrochemical Society. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Electrochemical Society, Inc. | - |
dc.title | Improved Adhesion of Metal Electrode Layer on Si3N4 Substrate through an All-Wet Process | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Chao, Yong-Ho | - |
dc.identifier.doi | 10.1149/2.0171901jss | - |
dc.identifier.scopusid | 2-s2.0-85083983533 | - |
dc.identifier.wosid | 000460343500001 | - |
dc.identifier.bibliographicCitation | ECS Journal of Solid State Science and Technology, v.8, no.2, pp.159 - 164 | - |
dc.relation.isPartOf | ECS Journal of Solid State Science and Technology | - |
dc.citation.title | ECS Journal of Solid State Science and Technology | - |
dc.citation.volume | 8 | - |
dc.citation.number | 2 | - |
dc.citation.startPage | 159 | - |
dc.citation.endPage | 164 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | MICROCHANNEL HEAT SINK | - |
dc.subject.keywordPlus | THERMAL-CONDUCTIVITY | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | DESIGN | - |
dc.subject.keywordPlus | ALPHA-SI3N4 | - |
dc.subject.keywordPlus | TECHNOLOGY | - |
dc.subject.keywordPlus | TITANIUM | - |
dc.subject.keywordPlus | ETHANOL | - |
dc.subject.keywordPlus | GLASS | - |
dc.subject.keywordPlus | TIO2 | - |
dc.subject.keywordAuthor | Electrodeposition - electroless | - |
dc.subject.keywordAuthor | adhesion enhancement | - |
dc.subject.keywordAuthor | Electroless deposition | - |
dc.subject.keywordAuthor | Si3N4 substrate | - |
dc.identifier.url | https://iopscience.iop.org/article/10.1149/2.0171901jss | - |
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