Improved Adhesion of Metal Electrode Layer on Si3N4 Substrate through an All-Wet Process
- Authors
- Kim, Danbi; Eom, Nu Si A.; Kim, Jiwon; Lee, Kyu Hyoung; Park, Sung Heum; Lee, Ju Ho; Chao, Yong-Ho; Lim, Jae-Hong
- Issue Date
- Mar-2019
- Publisher
- Electrochemical Society, Inc.
- Keywords
- Electrodeposition - electroless; adhesion enhancement; Electroless deposition; Si3N4 substrate
- Citation
- ECS Journal of Solid State Science and Technology, v.8, no.2, pp.159 - 164
- Indexed
- SCIE
SCOPUS
- Journal Title
- ECS Journal of Solid State Science and Technology
- Volume
- 8
- Number
- 2
- Start Page
- 159
- End Page
- 164
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/182090
- DOI
- 10.1149/2.0171901jss
- ISSN
- 2162-8769
- Abstract
- Electroless deposition requires preliminary surface treatment to effectively adsorb a metal electrode layer onto a ceramic substrate. Herein, a simple surface treatment using an all-wet process was performed to achieve adhesion stability between a Si3N4 substrate and Ni film. The method involved deposition of an interfacial Pd-TiO2 buffer between the two layers. Surface pretreatment via silanization was initially performed to improve surface wettability, thereby enhancing uniform deposition of Pd-TiO2. Subsequently, a thin Ni layer was directly deposited onto the Pd-TiO2 layer without necessitating sensitization or activation. The synthesized Ni/Pd-TiO2/Si3N4 heat sink exhibited excellent adhesion property in the cross-hatch, scratch, and thermal shock tests. The mechanism of adhesion enhancement involved chemical bonding of Pd-TiO2 with the self-assembled monolayer on the substrate and reduced internal stress due to removal of residual hydrogen between the layers of the heat sink. Thus, the fabricated heat sink has a promising application in electronic devices operated at high temperatures. (C) 2019 The Electrochemical Society.
- Files in This Item
-
Go to Link
- Appears in
Collections - ETC > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/182090)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.