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히트싱크유로형상에 따른 IGBT 부위별 온도 및 방열 성능 분석
- Authors
- 김영범
- Issue Date
- 21-Apr-2022
- Publisher
- 대한기계학회
- Citation
- 대한기계학회 열공학부문 2022년 춘계학술대회
- Conference Name
- 대한기계학회 열공학부문 2022년 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Young Beom
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)