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Life-prediction of Ag sintered die attach interconnects for SiC power module semiconductor
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2023-04-03T18:03:23Z | - |
| dc.date.available | 2023-04-03T18:03:23Z | - |
| dc.date.created | 2023-02-11 | - |
| dc.date.issued | 2022-11-10 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/183854 | - |
| dc.publisher | KMEPS (The Korean Microelectronics and Packaging Society) | - |
| dc.title | Life-prediction of Ag sintered die attach interconnects for SiC power module semiconductor | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김학성 | - |
| dc.identifier.bibliographicCitation | ISMP 2022 (International Symposium on Microelectronics and Packaging) | - |
| dc.relation.isPartOf | ISMP 2022 (International Symposium on Microelectronics and Packaging) | - |
| dc.citation.title | ISMP 2022 (International Symposium on Microelectronics and Packaging) | - |
| dc.citation.conferencePlace | 부산, 한화 리조트 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)