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Prediction of crack type and fatigue life of printed circuit board with respect to solder composition under repeated thermal cycle
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2023-04-03T18:03:35Z | - |
| dc.date.available | 2023-04-03T18:03:35Z | - |
| dc.date.issued | 2022-11-11 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/183858 | - |
| dc.title | Prediction of crack type and fatigue life of printed circuit board with respect to solder composition under repeated thermal cycle | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | ISMP 2022 (International Symposium on Microelectronics and Packaging) | - |
| dc.citation.conferencePlace | 부산, 한화 리조트 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)