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Prediction of Solder Fatigue Life of Package by Automated Parametric Modeling Simulation Technique
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2023-04-03T18:03:42Z | - |
| dc.date.available | 2023-04-03T18:03:42Z | - |
| dc.date.issued | 2022-11-15 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/183860 | - |
| dc.title | Prediction of Solder Fatigue Life of Package by Automated Parametric Modeling Simulation Technique | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | KISM 2022 | - |
| dc.citation.conferencePlace | 부산 파라다이스 호텔 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)