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Thermal fatigue life-prediction of microelectronics package with respect to solder type under repeated thermal cycle test
- Authors
- 김학성
- Issue Date
- 15-Nov-2022
- Place
- 부산 파라다이스 호텔
- Conference Name
- KISM 2022
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)