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Wafer Layer Transfer for Monolithic 3D (M3D) Integration using SOI Substrate and Smart-Cut
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 최창환 | - |
| dc.date.accessioned | 2023-04-03T18:04:52Z | - |
| dc.date.available | 2023-04-03T18:04:52Z | - |
| dc.date.created | 2023-02-11 | - |
| dc.date.issued | 2022-11-16 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/183883 | - |
| dc.publisher | 한국반도체디스플레이기술학회 | - |
| dc.title | Wafer Layer Transfer for Monolithic 3D (M3D) Integration using SOI Substrate and Smart-Cut | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 최창환 | - |
| dc.identifier.bibliographicCitation | Korean International Semiconductor Conference on Manufacturing Technology (KISM) | - |
| dc.relation.isPartOf | Korean International Semiconductor Conference on Manufacturing Technology (KISM) | - |
| dc.citation.title | Korean International Semiconductor Conference on Manufacturing Technology (KISM) | - |
| dc.citation.conferencePlace | 부산 파라다이스호텔 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)