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A study on the flash-light sintering characteristics with respect to the pattern width and interval of the inkjet-printed copper nano ink on the paper substrate

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dc.contributor.authorChoi, Sungjun-
dc.contributor.authorJang, Yong-Rae-
dc.contributor.authorKim, Hak-Sung-
dc.contributor.authorLee, Caroline Sunyong-
dc.date.accessioned2023-06-01T07:03:43Z-
dc.date.available2023-06-01T07:03:43Z-
dc.date.issued2023-03-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/185856-
dc.description.abstractIn this study, the flash-light sintering characteristics with respect to the width and interval of inkjet-printed copper nanoparticles (CPNs) patterns on paper substrates were investigated. By experiments and simulations, it was confirmed that the wider the width and the narrower the interval between patterns, flash-light sintering characteristics were improved by higher heat generation. In addition, it was confirmed that the electrode was uniformly sintered and adhesion to the substrate was enhanced through auxiliary heating of 80 °C.-
dc.format.extent4-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleA study on the flash-light sintering characteristics with respect to the pattern width and interval of the inkjet-printed copper nano ink on the paper substrate-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/EDTM55494.2023.10103068-
dc.identifier.scopusid2-s2.0-85158132226-
dc.identifier.wosid001004185500136-
dc.identifier.bibliographicCitation2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), pp 1 - 4-
dc.citation.title2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)-
dc.citation.startPage1-
dc.citation.endPage4-
dc.type.docTypeProceedings Paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.subject.keywordPlusCopper-
dc.subject.keywordPlusNanoparticles-
dc.subject.keywordPlusSubstrates-
dc.subject.keywordPlusSintering-
dc.subject.keywordPlus1-octanethiol-
dc.subject.keywordPlusCopper nano inks-
dc.subject.keywordPlusCopper nanoparticles-
dc.subject.keywordPlusFlash light-
dc.subject.keywordPlusFlash-light sintering-
dc.subject.keywordPlusInk jet-
dc.subject.keywordPlusInk-jet printing-
dc.subject.keywordPlusOctanethiol-
dc.subject.keywordPlusPaper substrate-
dc.subject.keywordPlusSintering characteristics-
dc.subject.keywordAuthor1-octanethiol-
dc.subject.keywordAuthorCopper nano-particles-
dc.subject.keywordAuthorFlash-light sintering-
dc.subject.keywordAuthorInkjet printing-
dc.subject.keywordAuthorPaper substrate-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/10103068-
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